The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Jul. 01, 2020
Applicant:

Coorstek, Inc., Golden, CO (US);

Inventors:

Ramesh Divakar, Arvada, CA (US);

Matthew Simpson, Evergreen, CO (US);

Alan Filer, Longmont, CO (US);

Assignee:

CoorsTek, Inc., Golden, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/00 (2026.01); C04B 35/584 (2006.01); C04B 35/63 (2006.01); C04B 35/634 (2006.01); C04B 41/00 (2006.01); C04B 41/45 (2006.01); C04B 41/50 (2006.01); C04B 41/87 (2006.01); F27D 5/00 (2006.01); H05B 3/12 (2006.01); H05B 3/28 (2006.01);
U.S. Cl.
CPC ...
H10P 72/0432 (2026.01); C04B 35/584 (2013.01); C04B 35/6303 (2013.01); C04B 35/634 (2013.01); C04B 41/009 (2013.01); C04B 41/4539 (2013.01); C04B 41/5024 (2013.01); C04B 41/87 (2013.01); F27D 5/0037 (2013.01); H05B 3/12 (2013.01); H05B 3/283 (2013.01); C04B 2235/3224 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/3873 (2013.01); C04B 2235/3891 (2013.01); C04B 2235/6025 (2013.01); C04B 2235/656 (2013.01); C04B 2235/658 (2013.01); C04B 2235/661 (2013.01); H05B 2203/037 (2013.01);
Abstract

A wafer heater assembly comprises a heater substrate and a non-porous outermost layer. The heater substrate comprises silicon nitride (SiN) and includes at least one heating element embedded therein. The non-porous outermost layer is associated with at least a first surface of the heater substrate. The non-porous outermost layer comprises a rare-earth (RE) disilicate (RESiO); where RE is one of Yb and Y. The non-porous outermost layer includes an exposed surface configured to contact a wafer for heating, the exposed surface opposite the first surface of the heater substrate. Methods of making wafer heater assemblies are also disclosed as well as methods of using the wafer heater assembly.


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