The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Feb. 08, 2023
Applicants:

Ngk Insulators, Ltd., Nagoya-City, JP;

Ngk Adrec Co., Ltd., Mitake Cho, JP;

Inventors:

Sora Goto, Komaki-City, JP;

Shuhei Kuno, Komaki-City, JP;

Daisuke Kimura, Nagoya-City, JP;

Hiroomi Matsuba, Mizunami, JP;

Assignees:

NGK INSULATORS, LTD., Nagoya, JP;

NGK ADREC CO., LTD., Mitake Cho, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 14/69 (2026.01); H10P 14/60 (2026.01);
U.S. Cl.
CPC ...
H10P 14/6905 (2026.01); H10P 14/6322 (2026.01);
Abstract

Provided is a method of manufacturing a Si—SiC-based composite structure capable of improving the manufacturing efficiency of the Si—SiC-based composite structure. The method of manufacturing a Si—SiC-based composite structure includes a step of impregnating a molten metal containing Si into a molded body containing SiC by heating a supply body containing Si under a state in which the supply body is in contact with the molded body, wherein a contact portion of the supply body with the molded body is a part of a surface of the supply body facing the molded body.


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