The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Nov. 02, 2023
Applicant:

Trina Solar Co., Ltd., Changzhou, CN;

Inventors:

Chengfa Liu, Changzhou, CN;

Hong Chen, Changzhou, CN;

Daming Chen, Changzhou, CN;

Yifeng Chen, Changzhou, CN;

Assignee:

TRINA SOLAR CO., LTD., Changzhou, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 71/00 (2025.01); H10F 77/20 (2025.01); H10F 77/70 (2025.01); H10F 77/30 (2025.01);
U.S. Cl.
CPC ...
H10F 71/129 (2025.01); H10F 71/00 (2025.01); H10F 71/121 (2025.01); H10F 77/211 (2025.01); H10F 77/703 (2025.01); H10F 77/311 (2025.01);
Abstract

The present application relates to a method for manufacturing a solar cell. In the method, a wafer including a substrate and a doped conducting material layer is provided. A first surface and a portion of a first side surface of the substrate include a textured structure. The doped conducting material layer covers the textured structure. A passivating contact material layer is formed on each surface of the wafer. The wafer formed with the passivating contact material layer is cut along the thickness direction of the substrate to form a sub-wafer, so as to form a doped conducting layer. The passivating contact material layer is etched to form a passivating contact layer. A first passivation layer is formed on the doped conducting layer, and further covers at least a portion of a cut edge side surface which is a side surface of the sub-wafer formed by cutting the wafer.


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