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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12660344 B1

PDFFull Text
Date of Patent:
Jun. 16, 2026

Filed:

Sep. 03, 2021

Solid-state imaging device and recognition system having multiple pixels stacked in the vertical direction

Applicant:

Sony Group Corporation, Tokyo, JP;

Inventor:

Kei Nakagawa, Kanagawa, JP;

Assignee:

Sony Group Corporation, Tokyo, JP;

Attorney:

SHERIDAN ROSS P.C.

Primary Examiner:

Georgia Y Epps

Assistant Examiner:

Erin R Garber

Int. Cl.
CPC ...
H10F 39/00 (2025.01); H04N 5/33 (2023.01); H04N 25/13 (2023.01); H04N 25/17 (2023.01); H04N 25/705 (2023.01); H04N 25/78 (2023.01); H10F 39/12 (2025.01); H10F 39/18 (2025.01); H04N 23/12 (2023.01);
U.S. Cl.
CPC ...
H10F 39/802 (2025.01); H04N 5/33 (2013.01); H04N 25/134 (2023.01); H04N 25/17 (2023.01); H04N 25/705 (2023.01); H04N 25/78 (2023.01); H10F 39/184 (2025.01); H10F 39/192 (2025.01); H04N 23/12 (2023.01); H10F 39/8037 (2025.01); H10F 39/8053 (2025.01);
Abstract

To achieve more secure authentication. A solid-state imaging device according to an embodiment includes: a plurality of unit pixels arranged in a matrix; and signal processing circuits each of which reads out a signal from each of the unit pixels. Each of the unit pixels includes: a first pixel that is disposed on a first surface and that detects light of a first wavelength band; and a second pixel that is disposed on a second surface parallel to the first surface and that detects light of a second wavelength band different from the first wavelength band. The signal processing circuit includes a first conversion circuit that is connected to the first pixel and the second pixel in each of the unit pixels and that converts an analog signal output from each of the first pixel and the second pixel into a digital signal.

Find Patent Forward Citations

Nakagawa, Kei. (2026). Solid-state imaging device and recognition system having multiple pixels stacked in the vertical direction (U.S. Patent No. 12660344). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12660344

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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