The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Aug. 19, 2021
Applicant:

Sandisk Technologies Llc, Addison, TX (US);

Inventors:

Tatsuya Hinoue, Yokkaichi, JP;

Naoki Takeguchi, Nagoya, JP;

Assignee:

Sandisk Technologies, Inc., Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10B 43/20 (2023.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01); H10B 43/35 (2023.01);
U.S. Cl.
CPC ...
H10B 43/20 (2023.02); H10B 43/10 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02);
Abstract

A three-dimensional memory device includes a vertical repetition of multiple instances of a unit layer stack, memory openings vertically extending through the vertical repetition, and memory opening fill structures located within the memory openings. Each of the memory opening fill structures contains a respective vertical stack of memory elements. The unit layer stack includes, from bottom to top or from top to bottom, a cavity-free insulating layer that is free of any cavity therein, a first-type electrically conductive layer, a cavity-containing insulating layer including an encapsulated cavity therein, and a second-type electrically conductive layer.


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