The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Feb. 11, 2024
Applicant:

Bizlink International Corp., New Taipei City, TW;

Inventors:

Zhaojun Xu, New Taipei City, TW;

Jinhua Meng, New Taipei City, TW;

Assignee:

BIZLINK INTERNATIONAL CORP., New Taipei City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20436 (2013.01); G02B 6/4269 (2013.01); H05K 7/20463 (2013.01);
Abstract

A small form factor transceiver module includes a base, a printed circuit board, a cover, a heatsink and an adhesive. The printed circuit board has a connecting terminal. The printed circuit board is sandwiched between the base and the cover. The cover has at least one first groove and a mounting surface away from the printed circuit board. The first groove is located on the mounting surface. The adhesive is connected between the mounting surface and the heatsink. The first groove is configured to accommodate an excessive portion of the adhesive.


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Quick Actions:

Xu, Zhaojun. (2026). Small form factor transceiver module (U.S. Patent No. 12660130). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12660130

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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