The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Jun. 27, 2022
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Kouichirou Sugai, Kyoto, JP;

Shinya Higuchi, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/12 (2006.01); H01P 3/08 (2006.01); H01S 5/022 (2021.01);
U.S. Cl.
CPC ...
H05K 1/0219 (2013.01); H01P 3/081 (2013.01); H01S 5/022 (2013.01); H05K 2201/0979 (2013.01);
Abstract

To sufficiently reduce transmission loss and noise of a signal. A signal wire is located on a first surface of an insulation substrate, a first ground and a second ground are located on the first surface of the insulation substrate with the signal wire interposed therebetween, a via conductor electrically connecting the first ground and the lower ground is located at least one of on a second surface of the insulation substrate or inside the insulation substrate, and a side-surface metal layer electrically connecting the second ground and the lower ground is located on a third surface of the insulation substrate.


Find Patent Forward Citations

Sugai, Kouichirou. (2026). Wiring board and electronic device (U.S. Patent No. 12660079). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12660079

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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