The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Oct. 04, 2023
Sim Ip Hxr Llc, Sunny Isles Beach, FL (US);
Jamie Chilles, Bristol, GB;
Rachael Mcphillips, Bristol, GB;
Vijay Dontu, Bristol, GB;
Dan Sweeney, Cardiff, GB;
SIM IP HXR LLC, Sunny Isles Beach, FL (US);
Abstract
A flexible transducer designed with high volume manufacturing in mind is described, the where flexible transducer mount can be panelized into a grid form and the transducers assembled into the grid using commercially available pick-and-place tools. Once assembled, the mounted transducers may be attached to circuit boards using surface mount processes such as solder reflow or adhesive bonding via the electrical contacts on the underside of the flexible transducer mount. Further, maximization of the oscillating internal surface area that contributes to the acoustic pressure for a given transducer footprint area is described, which leads to greater packing density of transducers when used in an ultrasonic array. The greater packing density and pressure generated by the transducer aids with the miniaturization and cost reduction of mid-air haptic technology. The increase in acoustic power generation per unit area of transducer-occupied surface or footprint provides the possibility of producing transducers that are critically spaced.