The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Aug. 19, 2025
Applicant:

Energous Corporation, San Jose, CA (US);

Inventors:

Mallorie Burak, Eden, UT (US);

Alister Hoss, Long Beach, CA (US);

Assignee:

ENERGOUS CORPORATION, San Jose, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H02J 50/00 (2016.01); H02J 50/27 (2016.01); H02J 50/40 (2016.01); H02J 50/80 (2016.01);
U.S. Cl.
CPC ...
H02J 50/005 (2020.01); H02J 50/001 (2020.01); H02J 50/27 (2016.02); H02J 50/40 (2016.02); H02J 50/80 (2016.02);
Abstract

An encapsulated radio frequency (RF) wireless power circuit and method to produce said encapsulated RF wireless power circuits, including transmitter and receiver circuits. In an example, the circuits are used in industrial sensor applications. The encapsulation discussed herein provides benefits including that in some embodiments, it is low cost, low profile, and waterproof, amongst other benefits. The method is used to produce radio frequency (RF) wireless power transfer systems, antennas, and integrated circuits, among other devices, and is achieved via different approaches (e.g., single or multi stage over-molding or vacuum sealing), and using various types of encapsulation materials (e.g., resin or thin-film packaging) as will be discussed herein.


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