The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Feb. 03, 2023
Applicant:

Stemco Co., Ltd., Cheongju-si, KR;

Inventors:

Kang Dong Kim, Seongnam-si, KR;

Chang Hoon Han, Sejong-si, KR;

Hyun Woo Kim, Daejeon, KR;

Su Jeong Shin, Cheongju-si, KR;

Assignee:

STEMCO CO., LTD., Cheongju-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 5/00 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 5/003 (2013.01); H01F 17/0006 (2013.01); H01F 17/0013 (2013.01); H01F 2027/2809 (2013.01);
Abstract

Provided is a coil substrate having an asymmetric structure, in which the area of a coil pattern included in a first region is expanded relative to the area of a coil pattern included in a second region with respect to a virtual axis, and an electronic apparatus having the same. The coil substrate comprises a base layer; and a coil pattern spirally wound on the base layer, wherein an upper portion of the base layer is divided into a first region and a second region based on a void region formed inside the coil pattern, wherein an area of the coil pattern formed in the second region is larger than an area of the coil pattern formed in the first region.


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