The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Dec. 13, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jaehoon Kim, Suwon-si, KR;
Hyun-Ji Song, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 7/04 (2006.01); H01B 7/02 (2006.01); H01G 4/08 (2006.01); H01G 4/14 (2006.01); H05K 1/183 (2026.01); H10W 70/685 (2026.01); H01G 4/01 (2006.01); H01G 4/012 (2006.01);
U.S. Cl.
CPC ...
H01B 7/04 (2013.01); H01B 7/0216 (2013.01); H01G 4/085 (2013.01); H01G 4/14 (2013.01); H05K 1/183 (2013.01); H10W 70/685 (2026.01); H01G 4/01 (2013.01); H01G 4/012 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10583 (2013.01);
Abstract
A wire structure includes a metal layer, a dielectric layer covering at least a portion of an outer surface of the metal layer, and a filling material provided in the dielectric layer, wherein a flexibility of the filling material is higher than a flexibility of the dielectric layer.