The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Nov. 14, 2023
Applicants:

Sony Group Corporation, Tokyo, JP;

Sony Corporation of America, New York, NY (US);

Inventors:

Pranav Aniruddha Kadam, Sunnyvale, CA (US);

Alexandre Zaghetto, San Jose, CA (US);

Danillo Bracco Graziosi, Flagstaff, AZ (US);

Ali Tabatabai, Cupertino, CA (US);

Assignees:

SONY CORPORATION OF AMERICA, New York, NY (US);

SONY GROUP CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 9/00 (2006.01);
U.S. Cl.
CPC ...
G06T 9/002 (2013.01); G06T 9/001 (2013.01);
Abstract

An electronic device and method for using a rate adaptive codec for dynamic point cloud compression is provided. The electronic device receives a point cloud frame (PCF) sequence that includes a set of reference PCFs and a current PCF that is to be encoded. The electronic device generates 3D feature data based on application of a neural network-based encoder on at least one of the set of reference PCFs and the current PCF. The electronic device selects from an encoding pipeline, an encoding path as an I-frame encoding path or a P-frame encoding path for the current PCF. The selected encoding path extends from an output of the neural network-based encoder and includes a first sequence of transformation operations that is applicable on the 3D feature data. The electronic device generates a bit-stream of coded PCF based on application of the first sequence of transformation operations on the 3D feature data.


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