The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Aug. 30, 2022
Applicant:

Eaton Intelligent Power Limited, Dublin, IE;

Inventors:

Christopher Thomas Cantrell, Jackson, MI (US);

Manoj Prakash Gokhale, Magarpatta City, IN;

Rishabh Kumar Jain, Mundhwa, IN;

Parag Ashok Gumaste, Pune, IN;

Pranavamoorthy Balasubramanian, Chennai, IN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05D 23/19 (2006.01); B60L 58/24 (2019.01); B64D 27/34 (2024.01); B64D 27/357 (2024.01); B64D 33/08 (2006.01); G07C 5/02 (2006.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); H01M 10/633 (2014.01); H01M 10/6568 (2014.01);
U.S. Cl.
CPC ...
G05D 23/1919 (2013.01); B60L 58/24 (2019.02); B64D 27/34 (2024.01); B64D 27/357 (2024.01); B64D 33/08 (2013.01); G07C 5/02 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H01M 10/633 (2015.04); H01M 10/6568 (2015.04); B60L 2200/10 (2013.01); B60L 2240/425 (2013.01); B60L 2240/545 (2013.01); H01M 2220/20 (2013.01);
Abstract

A thermal management system proactively provides cooling to powered components and/or the battery of an aircraft based on expected temperature rises of the components. The thermal management system may monitor maneuver commands input by a pilot and/or may monitor a flight plan including maneuver commands and associated trigger events to determine when to take proactive steps. The thermal management system may adjust a coolant flow rate and/or may adjust a refrigerant flow rate to increase or decrease the level of cooling provided to various components.


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