The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Jul. 16, 2021
Applicant:

Societe Des Produits Nestle S.a., Vevey, CH;

Inventors:

Alexey Vishtal, Lausanne, CH;

Abhijit Bhattacharya, Epalinges, CH;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/082 (2006.01); B32B 27/08 (2006.01); B32B 27/10 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B65D 65/42 (2006.01); D21H 19/08 (2006.01); D21H 19/82 (2006.01); D21H 27/10 (2006.01);
U.S. Cl.
CPC ...
D21H 19/82 (2013.01); B32B 15/082 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/20 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); D21H 19/08 (2013.01); D21H 27/10 (2013.01); B32B 2307/538 (2013.01); B32B 2307/7244 (2013.01); B32B 2307/7246 (2013.01); B65D 65/42 (2013.01);
Abstract

The present invention relates generally to the field of multi-layer packaging material. In particular, the present invention relates to a multi-layer metallized paper-based packaging material comprising a paper layer, a pre metallization coating layer, a metallized layer, and at least one post metallization coating layer. The present invention further relates to the use of the multi-layer metallized paper-based packaging material in accordance with the present invention to package food and to a food package manufactured from the multi-layer metallized paper-based packaging material. In one embodiment of the present invention the multi-layer metallized paper-based packaging material can be recycled with other paper packaging materials.


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Vishtal, Alexey. (2026). Multi-layer metallized paper-based packaging material (U.S. Patent No. 12655584). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12655584

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