The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Sep. 22, 2021
Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Izumi Daido, Osaka, JP;

Toshio Takahashi, Osaka, JP;

Tokushige Shichiri, Osaka, JP;

Satoshi Hayashi, Osaka, JP;

Fumika Hoshino, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 179/08 (2006.01); C09J 11/04 (2006.01); C09J 11/08 (2006.01);
U.S. Cl.
CPC ...
C09J 179/08 (2013.01); C09J 11/04 (2013.01); C09J 11/08 (2013.01); C09J 2203/326 (2013.01); C09J 2301/124 (2020.08); C09J 2301/312 (2020.08); C09J 2301/408 (2020.08); C09J 2301/502 (2020.08);
Abstract

The present invention aims to provide a temporary fixing material that is easily separable even after high-temperature processing at 300° C. or higher with an adherend fixed thereon. The present invention also aims to provide a method for producing an electronic component using the temporary fixing material. Provided is a temporary fixing material containing a photocurable adhesive, the photocurable adhesive containing a reactive resin containing a resin (1) having an imide skeleton in a backbone repeating unit, the temporary fixing material having a light transmittance at 405 nm of 10% or greater and a 5% weight loss temperature of 350° C. or higher.


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