The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Apr. 28, 2021
Applicant:
Amosense Co., Ltd., Cheonan-si, KR;
Inventors:
Assignee:
AMOSENSE CO., LTD., Cheonan-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 5/06 (2006.01); C09J 7/25 (2018.01); C09J 7/35 (2018.01); C09J 11/04 (2006.01); H10W 90/00 (2026.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01);
U.S. Cl.
CPC ...
C09J 7/35 (2018.01); C09J 5/06 (2013.01); C09J 11/04 (2013.01); H10W 90/00 (2026.01); H10W 90/401 (2026.01); C09J 2203/326 (2013.01); C09J 2301/204 (2020.08); C09J 2301/208 (2020.08); C09J 2301/408 (2020.08); C09J 2301/502 (2020.08); H10W 72/01304 (2026.01); H10W 72/01323 (2026.01); H10W 72/07304 (2026.01); H10W 72/07331 (2026.01); H10W 72/07341 (2026.01); H10W 72/07353 (2026.01); H10W 72/321 (2026.01); H10W 72/322 (2026.01); H10W 72/334 (2026.01); H10W 72/352 (2026.01); H10W 90/734 (2026.01);
Abstract
The present disclosure relates to an adhesive transfer film for bonding a semiconductor chip and a spacer to a substrate and a method for manufacturing a power module substrate by using same, the adhesive transfer film being obtained by manufacturing an Ag sintering paste in the form of a film. The present disclosure can reduce the process time by minimizing a sintering process, and can reduce equipment investment cost.