The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Feb. 08, 2021
Bamstone New Material Technology (Wuhan) Co., Ltd., Wuhan, CN;
Wei Liu, Wuhan, CN;
Abstract
An epoxy resin composition with epoxy groups and active hydrogens having different molar equivalents includes an epoxy resin component and a curing agent component. A mixing ratio of the epoxy resin component and the curing agent component is a mixing ratio of a cured product with the highest glass transition temperature Tg among cured products with different mixing ratios measured experimentally. According to a weight percentage in a total weight of the epoxy resin component, the epoxy resin component includes: 50 wt % to 100 wt % of a bisphenol A epoxy resin. According to a weight percentage in a total weight of the curing agent component, the curing agent component includes: 60 wt % to 98 wt % of polyetheramine (PEA) and 2 wt % to 20 wt % of a low-viscosity Mannich base.