The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Dec. 12, 2022
Applicant:
Toppan Inc., Taito-ku, JP;
Inventors:
Hanae Tagami, Taito-ku, JP;
Shigeki Furukawa, Taito-ku, JP;
Assignee:
TOPPAN Inc., Taito-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/00 (2006.01); C08F 20/30 (2006.01); C08G 18/62 (2006.01); C08J 5/18 (2006.01); C08J 7/048 (2020.01);
U.S. Cl.
CPC ...
C08L 23/00 (2013.01); C08F 20/30 (2013.01); C08G 18/6229 (2013.01); C08J 5/18 (2013.01); C08J 7/048 (2020.01); C08J 2335/02 (2013.01);
Abstract
A resin composition including a resin R including a repeating unit having a partial structure of Formula (I) or (II): where Qis an ester bond shown in the Formula (I), Ris a substituent group, n1 is any of integers 1 to 5, * is a bonding site with a remainder of the repeating unit, and ** is a bonding site with a phenyl group in the Formula (I); where Qis a linking group or a single bond other than the ester bond of Qin Formula (I), Ris a substituent group, with at least one Rbeing a hydroxyl group, n2 is any of integers 1 to 5, and * is a bonding site with a remainder of the repeating unit.