The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Dec. 22, 2022
Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Masaru Akita, Nagoya, JP;

Masayuki Moriyama, Nagoya, JP;

Yuki Furukawa, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 69/26 (2006.01); C08J 11/08 (2006.01); C08K 5/092 (2006.01); C08K 5/5475 (2006.01); C08L 77/06 (2006.01);
U.S. Cl.
CPC ...
C08G 69/26 (2013.01); C08J 11/08 (2013.01); C08K 5/092 (2013.01); C08K 5/5475 (2013.01); C08L 77/06 (2013.01); C08L 2203/30 (2013.01);
Abstract

The present invention pertains to: a polyamide resin composition obtained by compounding, with respect to 100 parts by weight of a polyamide resin (A), 0.01-12 parts by weight of a silicone resin (B) and 0.01-5 parts by weight of a silane coupling agent (C) having at least one functional group selected from the group consisting of an isocyanate group, an epoxy group, and an acid anhydride group; a molded article thereof; and methods for producing the composition and the molded article. Provided is a polyamide resin composition which, even if the polyamide resin composition contains a silicone resin as an impurity, can suppress detachment of the silicone resin from a molded article obtained through injection molding of the polyamide resin composition and can suppress adhesion of the silicone resin to the surface of a mold during molding, and a molded article from which also can have excellent mechanical properties.


Find Patent Forward Citations

Akita, Masaru. (2026). Polyamide resin composition, molded article obtained by molding same, and methods for producing those (U.S. Patent No. 12655253). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12655253

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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