The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Dec. 02, 2024
Applicant:
Ddp Specialty Electronic Materials Us, Llc, Wilmington, DE (US);
Inventors:
Sergio Grunder, Freienbach, CH;
Daniel Schneider, Freienbach, CH;
Andreas Lutz, Freienbach, CH;
Marcel Aschwanden, Freienbach, CH;
Nina Hillesheim, Freienbach, CH;
Assignee:
DDP SPECIALTY ELECTRONIC MATERIALS US, LLC, Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 18/10 (2006.01); C08G 18/20 (2006.01); C08G 18/24 (2006.01); C08G 18/32 (2006.01); C08G 18/80 (2006.01); C08K 3/22 (2006.01); H01M 10/613 (2014.01); H01M 10/653 (2014.01);
U.S. Cl.
CPC ...
C08G 18/10 (2013.01); C08G 18/2063 (2013.01); C08G 18/24 (2013.01); C08G 18/3225 (2013.01); C08G 18/8067 (2013.01); C08K 3/22 (2013.01); H01M 10/613 (2015.04); H01M 10/653 (2015.04); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01);
Abstract
A new composition for thermal interface materials that provide improved thermal conductivity without requiring filler materials that are expensive or abrasive.