The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Aug. 04, 2022
Applicants:

Audi Ag, Ingolstadt, DE;

Mahle International Gmbh, Stuttgart, DE;

Inventors:

Patrick Then, Ingolstadt, DE;

Thomas Haltmeier, Elsendorf, DE;

Bernhard Danner, Ingolstadt, DE;

Christian Rebinger, Munich, DE;

Dominik Behnert, Leonberg, DE;

Timo Feldkeller, Asperg, DE;

Tobias Isermeyer, Löwenstein, DE;

Assignees:

AUDI AG, Ingolstadt, DE;

MAHLE INTERNATIONAL GMBH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60H 1/32 (2006.01); B60H 1/00 (2006.01); F25B 40/00 (2006.01);
U.S. Cl.
CPC ...
B60H 1/3229 (2013.01); B60H 1/00342 (2013.01); B60H 1/3227 (2013.01); B60H 1/32281 (2019.05); B60H 1/323 (2013.01); F25B 40/00 (2013.01); B60H 2001/3291 (2013.01); F25B 2400/04 (2013.01); F25B 2400/0403 (2013.01); F25B 2400/054 (2013.01);
Abstract

A module assembly for a refrigerant circuit of a motor vehicle. The module assembly includes an inner heat exchanger and a heat exchanger through which a coolant can flow. The inner heat exchanger is designed to transfer heat from a high-pressure side of the inner heat exchanger to a low-pressure side of the inner heat exchanger. The heat is introducible into a refrigerant compressible by the compressor by operating a compressor of the refrigerant circuit. The heat exchanger is subjected to refrigerant that can be supplied to the heat exchanger from the high-pressure side of the inner heat exchanger and can be expanded by an expansion device of the module assembly. The module assembly is formed separately from an evaporator of the refrigerant circuit and/or separately from a condenser of the refrigerant circuit. and includes a support device separate from the heat exchanger, on which the heat exchanger is held.


Find Patent Forward Citations

Loading…