The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Jan. 25, 2022
Applicant:

Kurtz Gmbh & Co. KG, Kreuzwertheim, DE;

Inventors:

Jarkko Siltamaeki, Fuerth, DE;

Bastian Gothe, Erlangen, DE;

Helge Weiger, Nuremberg, DE;

Andreas Seefried, Veitsbronn, DE;

Maximilian Drexler, Wilhermsdorf, DE;

Daniel S. Price, Herzogenaurach, DE;

Dietmar K. Drummer, Erlangen, DE;

Kevin Schneider, Erlangen, DE;

Assignee:

KURTZ GMBH & CO. KG, Kreuzwertheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 35/08 (2006.01); B29C 44/34 (2006.01); B29C 44/58 (2006.01); B29K 105/04 (2006.01);
U.S. Cl.
CPC ...
B29C 35/0805 (2013.01); B29C 44/3415 (2013.01); B29C 44/58 (2013.01); B29C 2035/0861 (2013.01); B29K 2105/048 (2013.01); B29K 2901/12 (2013.01); B29K 2995/0006 (2013.01);
Abstract

The present invention relates to a mold for molding a component, in particular a particle foam part and a method for manufacturing the component using such a mold. In one embodiment, a mold for molding a component comprises (a.) a mixture of a polymer material and a filler material, (b.) wherein the filler material is adapted to allow a heating of the component inside the mold by means of an electromagnetic field.


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