The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2026
Filed:
Jun. 02, 2022
Rohm and Haas Electronic Materials Cmp Holdings, Inc., Newark, DE (US);
Nan-Rong Chiou, Wilmington, DE (US);
DuPont Electronic Materials Holding, Inc., Newark, DE (US);
Abstract
A polishing pad for chemical mechanical polishing comprises: a polishing layer that comprises a polymer matrix that is the reaction product of an isocyanate terminated oligomer or polymer with a curative blend comprising a mono-aromatic polyamine curative and a polyamine curative having two or more aromatic rings, wherein the polymer matrix has hard segment domains and soft segment domains wherein pores are present in the polymer matrix, such pores being formed by expansion of pre-expanded fluid filled polymeric microspheres such expansion occurring during reaction of the isocyanate terminated oligomer or polymer with the mono-aryl amine curative and the poly-aryl amine curative, wherein the pores have a unimodal size distribution and wherein the polishing layer has a specific gravity of less than 0.70 g/cm.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile