The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2026

Filed:

Jul. 31, 2020
Applicant:

Bionime Corporation, Taichung City, TW;

Inventors:

Chun-Mu Huang, Taichung City, TW;

Chieh-Hsing Chen, Taichung City, TW;

Assignee:

Bionime Corporation, Taichung City, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/1455 (2006.01); A61B 5/00 (2006.01); A61B 5/145 (2006.01); A61B 5/15 (2006.01); A61B 17/34 (2006.01); B65D 81/26 (2006.01); A61B 5/1486 (2006.01); A61B 50/30 (2016.01);
U.S. Cl.
CPC ...
A61B 5/14503 (2013.01); A61B 5/0002 (2013.01); A61B 5/150305 (2013.01); A61B 5/150503 (2013.01); A61B 5/6833 (2013.01); A61B 5/6848 (2013.01); A61B 5/6849 (2013.01); A61B 17/3468 (2013.01); B65D 81/266 (2013.01); A61B 5/1451 (2013.01); A61B 5/14532 (2013.01); A61B 5/14865 (2013.01); A61B 50/30 (2016.02); A61B 2050/3004 (2016.02); A61B 2560/0443 (2013.01); A61B 2560/045 (2013.01); A61B 2560/063 (2013.01); A61B 2562/16 (2013.01); A61B 2562/242 (2013.01);
Abstract

An implantation device for prompt subcutaneous implantation of a sensor to measure a physiological signal of an analyte in a biofluid of a living body is disclosed. The implantation device includes a housing, an implantation module, a detachable module and a bottom cover. The housing has a bottom opening. The implantation module includes an implanting device and a needle extracting device. The detachable module includes the sensor detachably engaged with the implantation module; and a base configured to mount the sensor thereon. The bottom cover is detachably coupled to the bottom opening so that the housing and the bottom cover together form an accommodating space. The implantation module and the detachable module are accommodated in the accommodating space. The bottom cover has an operating portion configured to bear a force, and a supporting portion is formed on the opposite end of the operating portion.


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