The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Sep. 13, 2023
Applicant:

Nanya Technology Corporation, New Taipei City, TW;

Inventors:

Sheng-Fu Huang, New Taipei City, TW;

Shing-Yih Shih, New Taipei City, TW;

Assignee:

NANYA TECHNOLOGY CORPORATION, New Taipei City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H10W 72/90 (2026.01); H10W 99/00 (2026.01); H10W 80/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 72/90 (2026.01); H10W 99/00 (2026.01); H10W 72/951 (2026.01); H10W 72/952 (2026.01); H10W 72/981 (2026.01); H10W 80/312 (2026.01); H10W 80/327 (2026.01); H10W 90/792 (2026.01);
Abstract

A semiconductor device structure and method for manufacturing the same are provided. The semiconductor device structure includes a substrate, a dielectric structure, a pad, a conductive structure, and a buffer structure. The dielectric structure is disposed on the substrate. The pad is embedded in the dielectric structure. The conductive structure is disposed on the pad. The buffer structure is disposed on the pad and separates the conductive structure from the dielectric structure. A coefficient of thermal expansion (CTE) of the buffer structure ranges between a CTE of the dielectric structure and a CTE of the conductive structure.


Find Patent Forward Citations

Huang, Sheng-Fu. (2026). Semiconductor device structure including a bonding structure (U.S. Patent No. 12653059). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12653059

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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