The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Jul. 27, 2023
Applicant:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Inventors:
Adeel Ahmad Bajwa, Fort Washington, PA (US);
Thomas J. Colosimo, Jr., Fort Washington, PA (US);
Matthew B. Wasserman, Fort Washington, PA (US);
Robert N. Chylak, Fort Washington, PA (US);
Assignee:
Kulicke and Soffa, Industries, Inc., Fort Washington, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10W 72/0711 (2026.01); H10W 72/072 (2026.01); H10W 72/016 (2026.01); H10W 72/07125 (2026.01);
Abstract
A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a reducing gas delivery system configured to provide a reducing gas to a bonding area of a bonding system. The bonding system also includes a gas delivery line configured to transport the reducing gas from a reducing gas source to the reducing gas delivery system. At least a portion of the gas delivery line is heated.