The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Nov. 21, 2023
Applicant:

Denso Corporation, Kariya-city, JP;

Inventors:

Shintaro Kogure, Kariya-city, JP;

Satoshi Yamaura, Kariya-city, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 72/00 (2026.01); B60R 16/023 (2006.01); H02K 3/50 (2006.01); H02K 9/19 (2006.01); H02K 11/27 (2016.01); H02K 11/33 (2016.01); H10W 40/47 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 72/00 (2026.01); B60R 16/0238 (2013.01); H02K 3/50 (2013.01); H02K 9/19 (2013.01); H02K 11/27 (2016.01); H02K 11/33 (2016.01); H10W 40/47 (2026.01); H10W 90/00 (2026.01); H02K 2203/09 (2013.01);
Abstract

A power control apparatus includes a busbar unit which supports a plurality of busbars connected to a plurality of semiconductor modules. The busbar includes a first plate shaped portion and a second plate shaped portion. The first plate shaped portion is adjacent to a cooling device in a posture facing an internal passage of the cooling device in the plate thickness direction. The second plate shaped portion is placed in a posture in which a plate thickness direction thereof intersects with a plate thickness direction of the first plate shaped portion. The second plate shaped portion has outer surfaces including a side surface having a narrower width corresponding to a plate thickness. The second plate shaped portion is placed in a posture in which the side surface faces the semiconductor module.


Find Patent Forward Citations

Loading…