The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Dec. 31, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Seunghyun Cho, Suwon-si, KR;
Jaemin Jung, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A chip-on-film (COF) semiconductor package includes: a main film substrate having at least two module attachment regions spaced apart from each other; at least two sub-modules respectively attached to the at least two module attachment regions and spaced apart from each other on the main film substrate, wherein each of the at least two sub-modules comprise a sub-film substrate and a semiconductor chip mounted on the sub-film substrate; and at least two connection conductive layers provided between the main film substrate and the sub-film substrate, which is included in each of the at least two sub-modules, and electrically connecting the main film substrate to the at least two sub-modules.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile