The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Nov. 17, 2022
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Abstract
DSM-LGA using substrates with different surface finish options include copper posts for electrical communication. The copper posts include a height-to-width ratio that cannot be achieved in traditional copper posts, as well as a taper ratio that forms a more rectangular cross section as opposed to traditional copper posts. Additionally, by using copper, the copper posts include a relatively high thermal conductivity (as compared to solder), thus allowing the copper posts to dissipate thermal energy generated by integrated circuits and other processors. Copper posts can take the form of a single, cylindrical post. Alternatively, copper posts can be merged to form a variety of copper structures used for various applications, including I/O, grounding/isolation, and substrate support.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile