The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Apr. 19, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Kwang-Chul Choi, Suwon-si, KR;
Sang Hyun Lee, Suwon-si, KR;
Un-Byoung Kang, Suwon-si, KR;
Jung Hoon Kang, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a package substrate having a first side and an opposite second side, a semiconductor chip on the first side of the package substrate, a capacitor on the second side of the package substrate, a plurality of connecting terminals on the second side of the package substrate, and a metal line within a trench in the package substrate. The trench extends in a first direction, and the metal line is between the capacitor and the plurality of connecting terminals. The metal line is spaced apart from the capacitor in a second direction that is transverse to the first direction, and a distance between the metal line and the capacitor is 100 μm or more and 1000 μm or less.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile