The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Jan. 11, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Juil Choi, Suwon-si, KR;
Jusuk Kang, Suwon-si, KR;
Hyungjun Park, Suwon-si, KR;
Sanghyuck Oh, Suwon-si, KR;
Hyunju Lee, Suwon-si, KR;
Sangyeol Choi, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
Provided are a semiconductor package having a structure maximizing heat dissipation efficiency and a method of manufacturing the same. The semiconductor package includes a first redistribution substrate, a first semiconductor chip on the first redistribution substrate, a plurality of through posts on the first redistribution substrate, around the first semiconductor chip, and a second redistribution substrate located over the first semiconductor chip and the through posts, wherein a top surface of the first semiconductor chip is in contact with a bottom surface of the second redistribution substrate.