The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Oct. 30, 2023
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Nicholas Latham, Albany, NY (US);

Junwon Han, Loudonville, NY (US);

Kishan Jayanand, Cohoes, NY (US);

Nicholas Alexander Polomoff, Hopewell Junction, NY (US);

Aakrati Jain, Albany, NY (US);

Mary Mcgahay, Troy, NY (US);

Sathyanarayanan Raghavan, Ballston Lake, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/00 (2026.01); H10P 95/00 (2026.01); H10W 20/48 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 20/063 (2026.01); H10P 95/08 (2026.01); H10W 20/48 (2026.01); H10W 90/701 (2026.01);
Abstract

Embodiments of present invention provide a method. The method includes forming a set of metal pillars on a substrate; forming a negative-tone organic dielectric layer covering the set of metal pillars; planarizing the negative-tone organic dielectric layer to expose the set of metal pillars; forming a resist mask on the negative-tone organic dielectric layer, the resist mask having openings that expose the set of metal pillars; and forming a redistribution layer in the openings of the resist mask, the redistribution layer being in direct contact with the set of metal pillars. A structure formed thereby is also provided.


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