The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Feb. 08, 2023
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Yoshio Mizuta, Yokkaichi Mie, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); G01B 11/27 (2006.01); H10D 84/03 (2025.01); H10D 88/00 (2025.01); H10P 72/00 (2026.01); H10P 72/50 (2026.01); H10P 74/00 (2026.01); H10W 46/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/53 (2026.01); G01B 11/27 (2013.01); H10D 84/038 (2025.01); H10D 88/01 (2025.01); H10P 72/0428 (2026.01); H10P 74/23 (2026.01); H10W 46/00 (2026.01); H10W 46/301 (2026.01);
Abstract

According to one embodiment, a bonding apparatus includes first and second stages, first and second measuring devices, a stress generator, and a controller. The controller generates a focus map for each deformation amount of the first stage based on a deformation amount of the first stage deformed by the stress generator and the shape of the first substrate held by the deformed first stage. In the alignment processing of the first substrate, when causing the first measuring device to measure an alignment mark arranged on the first substrate held by the first stage, the controller uses a focus setting based on the focus map corresponding to the deformation amount applied to the first stage.


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