The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Sep. 06, 2022
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Oray O. Cellek, Los Altos, CA (US);

Fei Tan, San Jose, CA (US);

Gershon Rosenblum, Fremont, CA (US);

Hong Wei Lee, San Jose, CA (US);

Cheng-Ying Tsai, San Jose, CA (US);

Jae Y. Park, San Jose, CA (US);

Christophe Verove, Le Cheylas, FR;

John L Orlowski, Santa Clara, CA (US);

Siddharth Joshi, Grenoble, FR;

Xiangli Li, Palo Alto, CA (US);

David Coulon, Aix-en-Provence, FR;

Xiaofeng Fan, San Jose, CA (US);

Keith Lyon, San Jose, CA (US);

Nicolas Hotellier, Jarrie, FR;

Arnaud Laflaquière, Paris, FR;

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H04N 25/75 (2023.01); H10F 39/00 (2025.01); H10F 39/18 (2025.01);
U.S. Cl.
CPC ...
H10F 39/1847 (2025.01); H04N 25/75 (2023.01); H10F 39/1843 (2025.01); H10F 39/8053 (2025.01); H10F 39/811 (2025.01);
Abstract

A multispectral sensing device includes a first die, including silicon, which is patterned to define a first array of sensor elements, which output first electrical signals in response to optical radiation that is incident on the device in a band of wavelengths less than 1000 nm that is incident on the front side of the first die. A second die has its first side bonded to the back side of the first die and includes a photosensitive material and is patterned to define a second array of sensor elements, which output second electrical signals in response to the optical radiation that is incident on the device in a second band of wavelengths greater than 1000 nm that passes through the first die and is incident on the first side of the second die. Readout circuitry reads the first electrical signals and the second electrical signals serially out of the device.


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