The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Mar. 28, 2023
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventor:

Susumu Kagohashi, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 3/423 (2013.01); H05K 2201/09845 (2013.01);
Abstract

A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer, and a via conductor formed in an opening formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The via conductor is formed such that the via conductor includes a seed layer covering an inner wall surface of the resin insulating layer inside of the opening and an electrolytic plating layer formed on the seed layer such that the seed layer has a plurality of columnar parts grown in columnar shapes.


Find Patent Forward Citations

Kagohashi, Susumu. (2026). Printed wiring board (U.S. Patent No. 12652755). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12652755

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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