The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Nov. 28, 2023
Applicant:

Transound Electronics Co., Ltd., Dongguan, CN;

Inventors:

Tseng-Feng Wen, New Taipei, TW;

Chun-Han Huang, New Taipei, TW;

Chung-Hsien Tseng, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 9/04 (2006.01); H04R 9/06 (2006.01);
U.S. Cl.
CPC ...
H04R 9/046 (2013.01); H04R 9/06 (2013.01);
Abstract

The present disclosure provides a voice coil structure and a loudspeaker. The voice coil structure includes a substrate, a first wiring layer disposed on the substrate, and a first insulation layer disposed on the first wiring layer. The first wiring layer has a winding structure. The first wiring layer further includes a first end and a second end. The first insulation layer defines a through hole and a first notch. The first end is exposed from the through hole, and the second end is exposed from the first notch.


Find Patent Forward Citations

Wen, Tseng-Feng. (2026). Voice coil structure and loudspeaker (U.S. Patent No. 12652496). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12652496

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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