The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Nov. 10, 2023
Applicant:

Hevo Inc., Brooklyn, NY (US);

Inventors:

Umer Anwer, Niagara Falls, CA;

Kerim Colak, Brooklyn, NY (US);

Jeremy Mccool, Brooklyn, NY (US);

Firat Uner, Istanbul, TR;

Dhaval Palsana, Torrance, CA (US);

Seunghoon Jeong, Torrance, CA (US);

Assignee:

HEVO, INC., Brooklyn, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02J 50/70 (2016.01); B60L 53/122 (2019.01); B60L 53/38 (2019.01); H02J 50/12 (2016.01); H02J 50/90 (2016.01);
U.S. Cl.
CPC ...
H02J 50/70 (2016.02); B60L 53/122 (2019.02); B60L 53/38 (2019.02); H02J 50/12 (2016.02); H02J 50/90 (2016.02);
Abstract

Transmitter assemblies and methods for making and using the same. The transmitter assembly can be used for magnetic power transfer. The transmitter assembly can include a primary inductor configured to produce an electromagnetic field. The transmitter assembly can include a back shield unit including a primary back shield that has a first surface proximal to the primary inductor and a second surface opposite to the first surface. The primary back shield is at least partially made of a ferromagnetic material and has a property that is non-uniformly distributed from a center region of the primary back shield to an outer perimeter region of the primary back shield. The property includes a thickness, a magnetic property, or a combination thereof. When used in wireless charging, the transmitter assembly results in improved coupling factor, misalignment tolerance, efficiency, magnetic emissions and z-height coupling distance of a magnetic power transfer profile.


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