The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Feb. 18, 2022
Applicant:

St. Jude Medical, Cardiology Division, Inc., St. Paul, MN (US);

Inventor:

Arthur G. Blanck, Ramona, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 20/10 (2006.01); B23K 1/00 (2006.01); B23K 1/06 (2006.01); H01R 12/61 (2011.01); H01R 43/02 (2006.01); H05K 1/11 (2006.01); B23K 101/36 (2006.01); B23K 103/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01R 43/02 (2013.01); B23K 1/0016 (2013.01); B23K 1/06 (2013.01); H01R 12/61 (2013.01); H01R 43/0207 (2013.01); H05K 1/118 (2013.01); B23K 2101/36 (2018.08); B23K 2103/42 (2018.08); H05K 1/0346 (2013.01); H05K 2201/0154 (2013.01);
Abstract

A first flexible electronic circuit includes a non-conductive substrate and a conductive trace layer, including a bonding pad, on a surface of the non-conductive substrate. A second flexible electronic circuit likewise includes a substrate and a conductive trace layer, including a bonding pad, on a surface of the non-conductive substrate. The second flexible electronic circuit also includes a conductive interface layer on an opposite surface of the non-conductive substrate to the bonding pad. A plurality of vias, filled with conductive material, extend through the substrate of the second flexible electronic circuit and couple the conductive interface layer to the bonding pad. The bonding pads are brought in contact with each other, and energy (e.g., ultrasonic energy or thermal energy) is applied to the conductive interface layer until the bonding pads are bonded (e.g., ultrasonically welded or soldered) to each other.


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