The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Dec. 24, 2020
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Daiki Ishii, Tokyo, JP;

Yoshihiko Yano, Tokyo, JP;

Yuki Yamashita, Tokyo, JP;

Kenichi Yoshida, Tokyo, JP;

Tetsuhiro Takahashi, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 9/15 (2006.01); H01G 4/33 (2006.01); H01G 9/055 (2006.01); H05K 1/18 (2026.01);
U.S. Cl.
CPC ...
H01G 9/15 (2013.01); H01G 4/33 (2013.01); H01G 9/055 (2013.01); H05K 1/18 (2013.01);
Abstract

To provide a thin film capacitor having high flexibility. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. The particle diameter of crystal at a non-roughened center part of the metal foil is less than 15 μm in the planar direction and less than 5 μm in the thickness direction. This can not only enhance the flexibility of the metal foil to reduce a short-circuit failure in a state where the thin film capacitor is incorporated in a multilayer substrate but also enhance positional accuracy.


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