The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Dec. 09, 2022
Applicant:

Macom Technology Solutions Holdings, Inc., Lowell, MA (US);

Inventors:

Jeremy Fisher, Raleigh, NC (US);

Marvin Marbell, Cary, NC (US);

Haedong Jang, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/40 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01G 4/012 (2006.01); H01G 4/228 (2006.01); H01G 4/33 (2006.01); H01G 4/38 (2006.01); H10D 1/20 (2025.01); H10D 1/68 (2025.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H01G 4/40 (2013.01); H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01G 4/228 (2013.01); H01G 4/33 (2013.01); H01G 4/38 (2013.01); H10D 1/20 (2025.01); H10D 1/692 (2025.01); H10W 90/00 (2026.01); H01G 4/012 (2013.01); H10W 90/754 (2026.01); H10W 90/759 (2026.01);
Abstract

A device according to some embodiments includes a first IPD die including a first SiC substrate. The first IPD die has a first surface and a second surface on the first SiC substrate opposite the first surface and includes a first contact and at least one first metal portion on the respective surfaces of the first SiC substrate. The device further includes a second IPD die including a second SiC substrate. The second IPD die has a third surface and a fourth surface on the second SiC substrate opposite the third surface and includes a second contact and at least one second metal portion on the respective surfaces of the second SiC substrate. The device further includes an electrical interconnection structure between one of the first and second surfaces of the first IPD die and one of the third and fourth surfaces of the second IPD die.


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