The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Mar. 19, 2024
Applicant:

Promerus, Llc, Akron, OH (US);

Inventor:

Pramod Kandanarachchi, Akron, OH (US);

Assignee:

PROMERUS, LLC, Akron, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/038 (2006.01); C08G 73/10 (2006.01); C08G 73/12 (2006.01); G03F 7/004 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0387 (2013.01); C08G 73/101 (2013.01); C08G 73/1025 (2013.01); C08G 73/1032 (2013.01); C08G 73/1085 (2013.01); C08G 73/122 (2013.01); C08G 73/124 (2013.01); G03F 7/0045 (2013.01);
Abstract

Embodiments in accordance with the present invention encompass photosensitive compositions containing a variety of soluble polyimide polymers and various additives including photoacid generator, photo radical generator and one or more photo crosslinking agents which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom can be readily cured at lower temperatures than the conventional polyimides and exhibit improved thermo-mechanical properties, among other property enhancements.


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