Breakout connector platform for interposer modules that implement densely pitched integrated circuits on conventional motherboards

Abstract

A breakout connector platform (BCP) increases the number of signals that can be exchanged with a densely pitched integrated circuit (DP-chip), such as a flip-chip, attached to an interposer module. The BCP is connected with the interposer module via mezzanine connectors, and includes breakout connectors and other connectors required for testing and operation of the DP-chip, including power, ground, and/or clock connectors. Mezzanine connections are arranged so that clusters of power connections, clusters of differential pairs of high frequency connections, and clusters of lower frequency control connections and/or differential pairs of clock connections are surrounded by ground connections. High frequency traces on the BCP are arranged as differential pairs. A plurality of interposer modules can be supported by the BCP. The interposer module can also include breakout connectors and/or a cover with cooling fan. Secondary mezzanine connectors can enable mounting of the BCP to an underlying motherboard.