The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Jan. 03, 2024
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Bradley Allen Newcomb, Troy, MI (US);

Jeffrey Norman Heaton, White Lake, MI (US);

Rodney James Campbell, Grand Blanc, MI (US);

Sean Robert Wagner, Shelby Township, MI (US);

Gerald Leonard O'neil, Essex, CA;

David S. Schulz, Livonia, MI (US);

Erik Brandon Golm, Sterling Heights, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16C 35/077 (2006.01); F16C 19/52 (2006.01); F16C 33/12 (2006.01);
U.S. Cl.
CPC ...
F16C 35/077 (2013.01); F16C 19/525 (2013.01); F16C 33/12 (2013.01); F16C 2208/04 (2013.01);
Abstract

A bearing interface assembly configured to accommodate different rates of thermal expansion of a bearing and a housing of an installation site. The bearing interface assembly includes: a metallic sleeve including an outer surface defining a groove and an inner surface defining an aperture configured to cooperate with the bearing, the metallic sleeve configured to expand at a first coefficient of thermal expansion; and a filament-wound composite overwrap seated within the groove of the metallic sleeve, the filament-wound composite overwrap configured to expand at a second coefficient of thermal expansion that is less than the first coefficient of thermal expansion to restrict expansion of the aperture to the second coefficient of thermal expansion.


Find Patent Forward Citations

Loading…