The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

Dec. 16, 2022
Applicant:

Winpak Ltd., Winnipeg, CA;

Inventors:

Chen Wan, Kingwood, TX (US);

Ming-Lun Wu, Richmond, TX (US);

Assignee:

Winpak Ltd., Winnipeg, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/12 (2006.01);
U.S. Cl.
CPC ...
C08L 23/12 (2013.01); C08L 2205/025 (2013.01);
Abstract

Described herein are high stiffness, high impact strength and clarified polypropylene-containing compositions. The disclosed compositions comprise a polypropylene, a nucleating agent, and optionally one or more additives. In certain aspects, the polypropylene includes a first polypropylene and a second polypropylene that is different from the first. The disclosed compositions exhibit high stiffness, high impact strength, improved clarity, and improved thermoformability. Also described herein are articles comprising the disclosed compositions and methods of manufacturing such articles.


Find Patent Forward Citations

Wan, Chen. (2026). High stiffness, high impact, clarified polypropylene compositions (U.S. Patent No. 12649849). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12649849

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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