The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2026

Filed:

May. 11, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Myungjae Jang, Suwon-si, KR;

Donghoon Kwon, Suwon-si, KR;

Jonghyuk Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 57/02 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
B24B 57/02 (2013.01); B24B 37/04 (2013.01);
Abstract

A substrate polishing apparatus includes; a platen including an upper surface configured to perform a polishing process on a semiconductor substrate, a slurry supply configured to supply slurry to the upper surface of the platen, wherein the slurry includes aqueous solution and abrasive particles, a collection pipe disposed under the platen and configured to guide the slurry, wherein the collection pipe includes a vertical guide pipe and a lateral guide pipe, a collection device disposed on an outer surface of the collection pipe, wherein the collection device includes an alternating arrangement of magnetic separators configured to separate the abrasive particles from the slurry using an electromagnetic force and sonicators configured to decompose the abrasive particles, and a collection tank connected to the collection pipe and configured to store the abrasive particles separated from the slurry by the collection device.


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