The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2026
Filed:
Dec. 04, 2020
Methods for preparing prefabricated crack defect and built-in crack defect, and prefabricated member
Aecc Shanghai Commercial Aircraft Engine Manufacturing Co., Ltd., Shanghai, CN;
Aecc Commercial Aircraft Engine Co., Ltd., Shanghai, CN;
Jun Fu, Shanghai, CN;
Liming Lei, Shanghai, CN;
Yali Li, Shanghai, CN;
Xinmin Zhou, Shanghai, CN;
Xin Fu, Shanghai, CN;
AECC SHANGHAI COMMERCIAL AIRCRAFT ENGINE MANUFACTURING CO., LTD., Shanghai, CN;
AECC COMMERCIAL AIRCRAFT ENGINE CO., LTD., Shanghai, CN;
Abstract
A method for preparing the prefabricated crack defects includes defining a defect area, defining a volume percentage of the crack defects in the defect area, adjusting the proportion of spherical powder, the proportion of hollow powder and process parameters of defect preparation according to the volume percentage of the crack defects, based on the technique of laser melting deposition, printing the defect area layer by layer by using the defect preparation powder and the process parameters of defect preparation, wherein the particle size of the defect preparation powder is between 45 μm and 150 μm, the proportion of spherical powder≥93% and the proportion of hollow powder<0.5%, the process parameters of defect preparation including: laser power of 450W-550W, scanning rate of 600 mm/min-1200 mm/min, powder feeding rate of 4 g/min-12 g/min, spot diameter of 1 mm-1.2 mm, scanning spacing of 0.5 mm-0.8 mm and layer thickness of 0.08 mm-0.2 mm.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile