The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
Mar. 30, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a substrate, a first chip structure disposed on the substrate, a second chip structure disposed on the substrate, at least one controller disposed between the first chip structure and the second chip structure, the at least one controller including edge pads disposed on edges opposing each other in a first direction, and center pads disposed between the edge pads, and bonding wire structures. The substrate includes first bonding pads arranged in a second direction, perpendicular to the first direction, and second bonding pads arranged in the second direction in at least one of a space between the first bonding pads and the first chip structure and a space between the first bonding pads and the second chip structure. The bonding wire structures include a first bonding wire structure connecting the edge pads to the first bonding pads, and a second bonding wire structure connecting the center pads to the second bonding pads.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile