The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
Jun. 22, 2023
Applicant:
Commissariat À L'énergie Atomique ET Aux Énergies Alternatives, Paris, FR;
Inventors:
Pierre Montmeat, Grenoble Cedex, FR;
Frank Fournel, Grenoble Cedex, FR;
Thierry Enot, Grenoble Cedex, FR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); H10W 74/01 (2026.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10W 74/01 (2026.01); H10W 72/01338 (2026.01); H10W 72/01371 (2026.01); H10W 72/0198 (2026.01); H10W 72/07311 (2026.01); H10W 72/07331 (2026.01);
Abstract
A manufacturing method of a structure intended for assembly with another structure by self-aligning bonding by hydrophilic contrast, including the following successive steps: a) definition of pads on the side of the first face of a first substrate; b) transfer of a second substrate on the side of the first face of the first substrate; c) formation on the sides and/or on a peripheral part of the upper face of the pads, of a material more hydrophobic than a material of the upper face of the pads; and d) removal of the second substrate.