The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2026

Filed:

May. 31, 2022
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Chin-Lung Ting, Miao-Li County, TW;

Liang-Lu Chen, Miao-Li County, TW;

Kuang-Ming Fan, Miao-Li County, TW;

Chia-Lin Yang, Miao-Li County, TW;

Chun-Hung Chen, Miao-Li County, TW;

Assignee:

Innolux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 40/22 (2026.01); H10P 74/00 (2026.01); H10W 40/00 (2026.01); H10W 70/09 (2026.01); H10W 70/60 (2026.01); H10W 70/652 (2026.01);
U.S. Cl.
CPC ...
H10W 40/228 (2026.01); H10P 74/273 (2026.01); H10W 40/037 (2026.01); H10W 70/09 (2026.01); H10W 70/60 (2026.01); H10W 70/6528 (2026.01);
Abstract

An electronic device and a manufacturing method thereof are disclosed. The electronic device includes a connector, an electronic component, and a heat sink. The connector has at least one conductive structure and at least one first heat dissipation structure. The at least one conductive structure and the at least one first heat dissipation structure are physically separated and electrically insulated from each other. The electronic component is electrically connected to the at least one conductive structure. The heat sink is connected to the at least one first heat dissipation structure. The heat sink and the electronic component are disposed on opposite sides of the connector.


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