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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12648418 B1

PDFFull Text
Date of Patent:
Jun. 02, 2026

Filed:

Apr. 20, 2022

Integrated atmospheric plasma treatment station in processing tool

Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Navaneetha Krishnan Subbaiyan, Portland, OR (US);

Patrick Little, West Linn, OR (US);

Daniel Mark Dinneen, Knocksentry, IE;

Shantinath Ghongadi, Tigard, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:

Weaver Austin Villeneuve & Sampson LLP

Primary Examiner:

Amar Movva

Int. Cl.
CPC ...
H01L 21/768 (2006.01); C25D 7/12 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76862 (2013.01); C25D 7/123 (2013.01); H01J 37/32376 (2013.01); H01J 37/3244 (2013.01); H01J 37/32825 (2013.01); H01J 37/32853 (2013.01); H01L 21/02057 (2013.01); H01L 21/02252 (2013.01); H01L 21/02315 (2013.01); H01L 21/0234 (2013.01); H01L 21/67167 (2013.01); H01L 21/67745 (2013.01); H01L 21/76873 (2013.01); H01L 21/02068 (2013.01); H01L 2224/80013 (2013.01);
Abstract

An atmospheric plasma treatment station is integrated in a semiconductor process tool. The atmospheric plasma treatment station directly interfaces with a deposition chamber of the semiconductor process tool without adding to the footprint or form factor of the semiconductor process tool. The atmospheric plasma treatment station includes a movable atmospheric plasma source such as a linear head for scanning across a surface of a substrate. The atmospheric plasma treatment station provides an enclosed space in a controlled environment with non-reactive gas flowing through the enclosed space. Process gases may be supplied to the linear head based on a surface condition of the substrate being treated.

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